The EuroPAT-MASIP project will reinforce the European semiconductor manufacturing position through focusing in the semiconductor and MEMS packaging ecosystem. Semiconductor packaging, assembly and test involve most of the semiconductor value chain, ranging from material suppliers to software design and packaging foundries to test houses. EuroPAT-MASIP will consolidate and extend the leadership in semiconductor processing know-how, by developing and fostering packaging related technological and manufacturing building blocks, serving different (emerging) industrial sectors. EuroPAT-MASIP will develop: Modelling, design and simulation of packaging related key features and challenges The key packaging technologies, equipment and materials Heterogeneous (3D) integration of the smart system building blocks (More than More, MtM) and System in Package (SIP); Test strategy including metrology, methods and equipment, reliability and failure analysis Furthermore, the project will accelerate the manufacturing uptake of the new technologies and shortening time-to-market by demonstrating the new capabilities industrial need based Application Pilots. The automotive industries related Application Pilots utilize manufacturing science but are based on industrial partner’s needs capabilities and needs, and thus industry-compatible.