WInSiC4AP will develop reliable, efficient and cost-effective Silicon Carbide (SiC) technology bricks for applications addressing social challenges and market segments, such as automotive, avionics, railway and security where Europe is a recognized global leader. Silicon Carbide (SiC) represents the forthcoming alternative to Silicon (Si) to get a higher efficiency and a higher power density in electronic devices. SiC devices have the capability to withstand high currents and high break-down voltages, and to operate at high temperatures. Hence, power systems based on SiC will exh...

WInSiC4AP will develop reliable, efficient and cost-effective Silicon Carbide (SiC) technology bricks for applications addressing social challenges and market segments, such as automotive, avionics, railway and security where Europe is a recognized global leader. Silicon Carbide (SiC) represents the forthcoming alternative to Silicon (Si) to get a higher efficiency and a higher power density in electronic devices. SiC devices have the capability to withstand high currents and high break-down voltages, and to operate at high temperatures. Hence, power systems based on SiC will exhibit a much higher efficiency and power density also with smaller device size and lower losses for passive components (higher switching frequency) and miniaturized auxiliary cooling systems (higher operation temperature). Though almost the full spectrum of SiC devices is available, at least at R&D level, the processes and the components are not yet always tailored for the different applications. WInSiC4AP aims to address this, working on the co-design of the system, of the semiconductors (together with its packaging) and of the passive components together, particularly focusing on the key sectors of mobility (electric road vehicles, railway systems, airplanes aerospace avionics) and energy distribution and conversion. WInSiC4AP relies on the strength of a vertical approach, allowing the optimization of the technologies by fitting application requirements, developing the full ecosystem and by tackling the relevant issues (e.g. the reliability and the EMC) inside the project. It will develop new topologies and architecture for targeted applications, simulating at laboratory level the operational environment, driving the needed yet still missing technologies, components and demonstrators. This approach will fill the gap between the current state of the art and the very high demanding specifications, will improve the competitive lead of EU Industries along the value chain, in a context where other geographies are currently accessing SiC technology to enter in the market.