Project information
- Project name
- 662133 PowerBase
- Period
- May 2015 - Apr 2018
- Call
- ECSEL-JU 2014
- Total Partners
- 39
- Member Partners
- 13
- Website
- www.powerbase-project.eu/
- EU Funding
- 18,36 M Euro
PowerBase will set up and enhance power semiconductor manufacturing pilot lines for wafer production and chip packaging, with special attention for compact power applications. Demonstrators and full-scale testing are essential building blocks in PowerBase, stepping up Europe's innovation capability by developing technologies specifically addressing energy efficient systems.
PowerBase will set up and enhance power semiconductor manufacturing pilot lines for wafer production and chip packaging, with special attention for compact power applications. Demonstrators and full-scale testing are essential building blocks in PowerBase, stepping up Europe's innovation capability by developing technologies specifically addressing energy efficient systems.
Project leader
- Name
- Herbert Pairitsch
- Organisation
- Infineon Technologies Austria AG
- Country
- Austria
