Project information

Name
737417 R3-PowerUP
Period
Nov 2017 - Apr 2021
Call
ECSEL-JU 2016
Total Partners
35
Members in Project
8
Website
r3powerup.eu/
EU Funding
28,05 M Euro

R3-POWERUP will push through the new generation of 300mm Pilot Line Facility for Smart Power technology in Europe. Through electric mobility and industrial power efficiency, the project will enable the European industry to set the world standards for innova- tive and competitive solutions for critical societal chal- lenges, such as energy saving, CO2 Reduction, as well as sustainable environment. Smart power ICs are key enabling components for applications in which Europe is playing a leading role: from mid-power automotive, to industrial power, battery management systems for HEV,...

R3-POWERUP will push through the new generation of 300mm Pilot Line Facility for Smart Power technology in Europe. Through electric mobility and industrial power efficiency, the project will enable the European industry to set the world standards for innova- tive and competitive solutions for critical societal chal- lenges, such as energy saving, CO2 Reduction, as well as sustainable environment. Smart power ICs are key enabling components for applications in which Europe is playing a leading role: from mid-power automotive, to industrial power, battery management systems for HEV, FEV and electric bikes, domotics, LED lighting for both indoor and outdoor, computer and industrial peripherals. Power and RF nanoelectronics represents about 30% of the industrial semiconductors business, and has been characterized by a stable growing market. The global demand for power electronics in systems is expected to have a CAGR (Compound Annual Growth Rate) of 2% until 2020. This will drive the market to 134 Billion US$ within the 2020. At the moment, 300mm fabs for Smart Power devices are present or announced only in the USA and in Asia. This is where R3-POWERUP steps it. It will establish the first 300mm Pilot Line in Europe for Smart Power and discrete power devices featuring 90nm lithography for high-density logic, analogue and power devices and embedded Non Volatile Memories for the realization of complex Systems-on-Chip. As such, it will fill the existing gap in the availability of 300mm Pilot Lines in Europe, which covers only Logic CMOS and discrete power devices. This project builds on the accomplishments of its pre-cursor R2POWER300, a project currently running under ECSEL JU Call 2014, which can be considered as a preparatory study for the big leap from 200mm to 300mm fab.

Project leader

Name
Roberto Zafalon
Organisation
STMicroelectronics s.r.l
Country
Italy